Institute of Research and Journals (IRAJ)
Trends in high performance processors are moving towards large scale integration and steady miniaturization to meet the aggressive performance targets. As the technology scales down circuits are providing extra ordinary integration densities with a drawback of increasing power densities. Dissipated power translates into heat and ultimately increases operating temperature causing reliability threats. In addition to this varying workloads will result in run-time thermal hotspots. It is recommended to employ on-die thermal sensors for effective thermal management. In this paper, the authors propose control logic for monitoring thermal sensors to achieve effective run time thermal management.