Efficient OpenMP Data Mapping for Multicore Platforms With Vertically Stacked Memory

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Provided by: edaa
Topic: Hardware
Format: PDF
Emerging TSV-based 3D integration technologies have shown great promise to overcome scalability limitations in 2D designs by stacking multiple memory dies on top of a manycore die. Application software developers need programming models and tools to fully exploit the potential of vertically stacked memory. In this paper, the authors focus on efficient data mapping for SPMD parallel applications on an explicitly managed 3D-stacked memory hierarchy, which requires placement of data across multiple vertical memory stacks to be carefully optimized. They propose a programming framework with compiler support that enables array partitioning.
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