Evaluation and Comparison of Single-Wall Carbon Nanotubes and Copper as VLSI Interconnect

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Provided by: International Journal of Innovative Research in Electrical, Electronics, Instrumentation and Control Engineering (IJIREEICE)
Topic: Hardware
Format: PDF
In this paper, the authors address the capabilities and performance of Single Wall Carbon NanoTube (SWCNT) bundles as interconnects for applications in VLSI circuits. The Carbon NanoTube (CNT) bundles have potential to provide an alternate solution for the resistivity and electro-migration problems faced by traditional copper interconnect in very deep submicron technology. Using an equivalent RLC model, the performance of CNT-bundle interconnects is compared to copper wires at different lengths. It is shown in the results that carbon nanotubes can easily replace conventional copper interconnects.
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