Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications

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Provided by: Institute of Electrical & Electronic Engineers
Topic: Hardware
Format: PDF
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in Ultra-Deep Sub-Micron (UDSM) technologies. Carbon NanoTube (CNT) based interconnects have been proposed as an alternative, because of their remarkable conductive, mechanical and thermal properties. In this paper, the authors investigate the system level performance of Single-Walled CNT (SWCNT) bundles, and mixed SWCNT/Multi-Walled CNT (MWCNT) bundles. Detailed RLC equivalent circuit models for conventional Cu and CNT bundle interconnects are described and used to determine propagation delays.
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