Flip-Chip Routing with Unified Area-I/O Pad Assignments for Package-Board Co-Design

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Provided by: Association for Computing Machinery
Topic: Hardware
Format: PDF
In this paper, the authors present a novel flip-chip routing algorithm for package-board co-design. Unlike the previous works that can consider only either free- or pre-assignment routing, their router is the first work in the literature that can handle both the free and pre-assignment routing. Based on the computational geometry techniques (e.g., the Delaunay triangulation and the Voronoi diagram), the router applies a unified network-flow formulation to perform congestion estimation for the pre-assignment routing. According to the congestion map, the network-flow formulation can also consider the free-assignment nets during the routing for the pre-assignment ones.
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