General Behavioral Thermal Modeling and Characterization for Multi-core Microprocessor Design

Provided by: edaa
Topic: Hardware
Format: PDF
In this paper, the authors propose a new architecture-level thermal modeling method to address the emerging thermal related analysis and optimization problem for high-performance multi-core microprocessor design. The new approach builds the thermal behavioral models from the measured or simulated thermal and power information at the architecture level for multi-core processors. Compared with existing behavioral thermal modeling algorithms, the proposed method can build the behavioral models from given arbitrary transient power and temperature waveforms used as the training data.

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