Heterogeneous 3D SiP Integration

Provided by: Intel Topic: Data Centers Date Added: Sep 2017 Format: PDF
Download this white paper to learn more about how Intel® Stratix® 10 FPGAs and SoCs leverage heterogeneous 3D SiP integration to deliver performance, power, and form factor breakthroughs while providing greater scalability and flexibility. In addition, learn how Intel EMIB technology delivers a superior solution for multi-die integration.

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