Heterogeneous 3D SiP Integration

Download this white paper to learn more about how Intel® Stratix® 10 FPGAs and SoCs leverage heterogeneous 3D SiP integration to deliver performance, power, and form factor breakthroughs while providing greater scalability and flexibility. In addition, learn how Intel EMIB technology delivers a superior solution for multi-die integration.

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Resource Details

Intel logo
Provided by:
Intel
Topic:
Data Centers
Format:
PDF