Georgia Institute of Technology
Die stacking is a promising new technology that enables integration of devices in the third dimension. It allows the stacking of multiple active layers directly on top of one another with short, dense die-to-die vias providing communication. The authors has shown significant benefits at all design targets, from stacking memory on logic to partitioning individual architectural units across multiple layers. Many high-speed processor units - ALUs, register files, caches, and instruction schedulers - have all been designed in 3D, achieving significant, simultaneous power savings and performance boosts.