Institute of Electrical and Electronics Engineers
Interactive packaging is an emerging research area in recent years. It brings people convenient and smart lives, reduces consumption of traditional packaging materials and direct or indirect labor costs as well. Being integrated in interactive packaging, Radio Frequency IDentification (RFID) technology becomes one of the most proactive development enablers. In this paper, an interactive and intelligent packaging solution integrating passive RFID system and Controlled Delamination Material (CDM) is given at first. Package opening action is electrically controlled by the RFID system. CDM is primarily used in aerospace applications in the past and the conductor/adhesive joint can be easily opened by applying a little electric power on to the material.