Is TSV-based 3D Integration Suitable for Inter-die Memory Repair?

Provided by: edaa
Topic: Hardware
Format: PDF
In this paper the authors address lower level issues related to 3D inter-die memory repair in an attempt to evaluate the actual potential of this approach for current and foreseeable technology developments. They propose several implementation schemes both for inter-die row and column repair and evaluate their impact in terms of particular area and delay. Their analysis suggests that current state-of-the-art TSV dimensions allow inter-die column repair schemes at the expense of reasonable area overhead.

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