International Journal of Engineering Research and Applications (IJERA)
A wireless sensor network is proposed for monitoring buildings to assess earthquake damage. The sensor nodes use custom-developed capacitive micro electro mechanical systems strain and 3-D acceleration sensors and a low power readout application-specified integrated circuit for a battery life of up to 12 years. The strain sensors are mounted at the base of the building to measure the settlement and plastic hinge activation of the building after an earthquake. They measure periodically or on-demand from the base station.