Microarchitectural Floorplanning Under Performance and Thermal Tradeoff

Provided by: European Design and Automation Association
Topic: Hardware
Format: PDF
In this paper, the authors present the first multi-objective microarchitectural floorplanning algorithm for designing high-performance, high-reliability processors in the early design phase. Their floorplanner takes a microarchitectural netlist and determines the placement of the functional modules while simultaneously optimizing for performance and thermal reliability. The traditional design objectives such as area and wirelength are also considered. Their multi-objective hybrid floorplanning approach combining linear programming and simulated annealing is shown to be fast and effective in obtaining high-quality solutions.

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