Modeling Temperature Distribution in Networks-on-Chip Using RC-Circuits

As transistor dimensions are shrinking into regions of only a few atomic layers, designers are faced with various problems including increased reliability and power issues. Since, these problems are amplified by higher circuit temperatures; in this paper, the authors propose an approach for the fine-grained modeling of temperature distribution in many-core systems based on Networks-on-Chip (NoC). With this model, algorithms can be developed that consider the significant impact of temperature - e.g. on performance, power or reliability. To simulate the dynamic nature of temperature, the thermal properties of according integrated systems are modeled through the instantiation of equivalent RC-circuits.

Provided by: University of Rome Topic: Hardware Date Added: Mar 2010 Format: PDF

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