Three-Dimensional (3D) Integrated Circuits (IC) are emerging as a viable solution to enhance the performance of Multi-Processor System-on-Chip (MPSoC). The use of high-speed hardware and the increased density of 3D architectures present novel challenges concerning thermal dissipation and power management. Most approaches at power and thermal modeling use either static analytical models or slow low-level analog simulations. In this paper, the authors propose a novel thermal modeling methodology for evaluation of 3D MPSoCs. The integration of this methodology in a virtual platform enables efficient dynamic thermal evaluation of a chip.