NDC: Analyzing the Impact of 3D-Stacked Memory+Logic Devices on MapReduce Workloads

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Provided by: The University of Tulsa
Topic: Storage
Format: PDF
While processing-in-memory has been investigated for decades, it has not been embraced commercially. A number of emerging technologies have renewed interest in this paper. In particular, the emergence of 3D stacking and the imminent release of micron's hybrid memory cube device have made it more practical to move computation near memory. However, the literature is missing a detailed analysis of a killer application that can leverage Near Data Computing (NDC) architecture. This paper focuses on in-memory MapReduce workloads that are commercially important and are especially suitable for NDC because of their embarrassing parallelism and largely localized memory accesses.
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