OPAL: A Multi-Layer Hybrid Photonic NoC for 3D ICs

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Provided by: Institute of Electrical & Electronic Engineers
Topic: Hardware
Format: PDF
Three-Dimensional Integrated Circuits (3D ICs) offer a significant opportunity to enhance the performance of emerging Chip Multi-Processors (CMPs) using high density stacked device integration and shorter Through Silicon Via (TSV) interconnects that can alleviate some of the problems associated with interconnect scaling. In this paper, the authors propose and explore a novel multi-layer hybrid photonic NoC fabric for 3D ICs. Their proposed hybrid photonic 3D NoC combines low cost photonic rings on multiple photonic layers with a 3D mesh NoC in active layers to significantly reduce on-chip communication power dissipation and packet latency.
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