Science & Engineering Research Support soCiety (SERSC)
In this paper, the authors present a sequence analysis method, which is one of the advanced data mining techniques, to identify and extract unique patterns from wafer manufacturing data. Wafer fabrication in the semiconductor industry is one of the most complex manufacturing processes. For such highly complicated operations, maintaining high yields through the statistical process control as a sole monitoring method for quality control is obviously inefficient. They thus investigate the intelligent and semi-automatic technique to help industrial engineers analyzing their production data.