University of Miami School of Business Administration
The confluence of 3D stacking, emerging dense memory technologies, and low-voltage throughput-oriented many-core processors has sparked interest in single-chip servers as building blocks for scalable data-centric system design. These chips encapsulate an entire memory hierarchy within a 3D-stacked multi-die package. Stacking alters key assumptions of conventional hierarchy design, drastically increasing cross-layer bandwidth and reducing the latency ratio between successive layers. Hence, prior work, specifically PicoServer, suggests flattening the hierarchy, eliding intermediate caches that otherwise lengthen the critical path between L1 and stacked memory.