Association for Computing Machinery
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated circuits. To address these thermal issues, state-of-the-art chips have integrated thermal sensors that monitor temperatures at a few selected die locations. These temperature measurements are then used by thermal management techniques to appropriately manage chip performance. Thermal sensors and their support circuitry incur design overheads, die area, and manufacturing costs. In this paper, the authors propose a new direction for full thermal characterization of integrated circuits based on spectral Fourier analysis techniques.