Purdue Federal Credit Union
There has been much work on the next generation of memory technologies such as MRAM, RRAM and PRAM. Most of these are non-volatile in nature, and compared to SRAM, they are often denser, just as fast, and have much lower energy consumption. Using 3-D stacking technology, it has been proposed that they can be used instead of SRAM in large level 2 caches prevalent in today's microprocessors. However, one of the key challenges in the use of these technologies, such as MRAM, is their higher fault probabilities arising from the larger process variation, defects in its fabrication, and the fact that the cache is much larger.