Association for Computing Machinery
Thermal management has become an increasingly important issue in modern semiconductor devices. In particular, steep thermal gradients have been shown to significantly reduce the reliability of silicon systems. This paper suggests that the thermal state of a processor can be approximated using data flow analysis. The results of this analysis can be used to evaluate the efficacy of thermal-aware compilation strategies, or as input to thermal-aware optimizations that occur in the early stages of back-end compilation. The authors propose different ways how the exploitation of thermal behavior knowledge can be included in the different compilation phases.