Provided by: Science & Engineering Research Support soCiety (SERSC)
Topic: Big Data
Date Added: Jul 2015
In this paper, the authors are going to use thermal aware approach in encoder design and also testing thermal stability by working on different ambient temperatures 298.15K, 308.15K, 318.15K, 328,15K, 338.15K and 348.15K and 358.15K. They have observed the compatibility of their device with wireless network by working on different I/O standards (LVCMOS15 and LVCMOS25). There is 30.29% reduction in leakage power, when they scale down temperature from 358.15K to 298.15K using LVCMOS15 as I/O standard on 40nm Virtex FPGA.