Thermal-Aware Memory Mapping in 3D Designs

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Provided by: edaa
Topic: Storage
Format: PDF
DRAM is usually used as main memory for program execution. The thermal behavior of a memory block in a 3D SIP is affected not only by the power behavior but also the heat dissipating ability of that block. The power behavior of a block is related to the applications run on the system while the heat dissipating ability is determined by the number of tier and the position the block locates. Therefore, a thermal-aware memory allocator should consider the following two points. First, allocator should consider not only the power behavior of a memory block but also the physical location during memory mapping, second, the changing temperature of a physical block during execution of programs.
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