Towards Thermally-Aware Design of 3D MPSoCs with Inter-Tier Cooling

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Provided by: edaa
Topic: Hardware
Format: PDF
New tendencies envisage 3D Multi-Processor System-on-Chip (MPSoC) design as a promising solution to keep increasing the performance of the next-generation High-Performance Computing (HPC) systems. However, as the power density of HPC systems increases with the arrival of 3D MPSoCs, supplying electrical power to the computing equipment and constantly removing the generated heat is rapidly becoming the dominant cost in any HPC facility. Thus, both power and thermal/cooling implications play a major role in the design of new HPC systems, given the energy constraints in the society. Therefore, EPFL, IBM and ETHZ have been working within the CMOSAIC program project in the last three years on the development of a holistic thermally-aware design.
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