TSV Redundancy: Architecture and Design Issues in 3D IC

Provided by: edaa
Topic: Hardware
Format: PDF
3D technology provides many benefits including high density, high band-with, low-power, and small form-factor. Through Silicon Via (TSV), which provides communication links for dies in vertical direction, is a critical design issue in 3D integration. Just like other components, the fabrication and bonding of TSVs can fail. A failed TSV may cause a number of known-good-dies that are stacked together to be discarded. This can severely increase the cost and decrease the yield as the number of dies to be stacked increases. A redundant TSV architecture with reasonable cost for ASICs is proposed in this paper. Design issues including recovery rate and timing problem are addressed.

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