Photos: The top developments in the future of computing from the Intel Developer Forum 2007

“Intel President and Chief Executive Officer Paul Otellini holds up a Penryn wafer during his keynote at the Intel Developer Forum in San Francisco on Tuesday [9/18/07]. Penryn is the codename of Intel’s next-generation Intel® Core™2 processor family, which is based on our industry-leading 45-nanometer (nm) Hi-k metal gate process technology and latest microarchitecture enhancements. Launching in November, 2007 it will be the world’s first high-volume 45 nanometer processor.”

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Moscone West in San Francisco played host to the Intel Developer Forum 2007.

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“Intel President and Chief Executive Officer Paul Otellini reiterates the company’s goals for processor performance and energy efficiency in his opening keynote address on Tuesday, Day 1 of the Intel Developer Forum at the Moscone Convention Center in San Francisco.”

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“Showing off a next-generation 45nm microarchitecture (codenamed ‘Nehalem’) wafer are Pat Gelsinger, senior vice-president and general manager Digital Enterprise Group, and Jim Brayton, Intel Nehalem project manager.”

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Pat Gelsinger, general manager of Intel’s Digital Enterprise Group, set high expectations for the Nehalem processor family that will begin shipping in 2008.

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“[Intel’s] Pat Gelsinger, senior vice president and general manager, Digital Enterprise Group, demonstrates a dual quad-core extreme gaming system, codenamed ‘Skulltrail.'”

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“Intel President and Chief Executive Officer Paul Otellini shows two PCs that are part of a new category of laptops designed to bring computers into schools in a seamless, cost-effective fashion. On the left is the Intel-powered classmate PC, currently in production, and on the right is Asus’ Eee PC, a sub-$200 laptop.”

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Intel co-founder Gordon Moore

Intel co-founder Gordon Moore, speaking on Tuesday, reminisced about the chipmaker’s history and projected that Moore’s Law has another 10 to 15 years of life in it.

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Intel co-founder Gordon Moore shares a laugh with Tech Nation’s Dr. Moira Gunn Tuesday at the Intel Developer Forum, which celebrated its 10th anniversary in San Francisco on September 18-20.

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“Technology luminary Gordon Moore, inventor of ‘Moore’s Law,’ makes a rare public appearance Tuesday at Intel Developer Forum. He waxed philosophically on the history of Intel Corporation, the 60th anniversary of the transistor and the future of computing.”

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This robotic card named “Junior” from Stanford, was one of the hottest attractions on Tuesday at IDF 2007.

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Sebastian Thurn, the professor overseeing Stanford’s Junior project brought the driverless car to IDF.

Junior, which uses radar to detect obstacles it must avoid, is competing in the Defense Advanced Research Projects Agency’s Urban Challenge. The competition is scheduled for November 3.

Intel is among the car’s sponsors.

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Onboard the driverless car are blade computers with Intel Core2 Duo processors and rack-mountable systems with Intel Core2 Quad processors.

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In the rear of the vehicle sits the computing gear that manipulates the vehicle and its information. Most of the hardware is consumer-grade electronics available at any computer store.

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Laser rangefinders mounted on the top and side of the vehicle spin more than 10 times per second, bouncing light off surrounding objects and giving the car the information it needs to avoid obstacles.

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The main laser rangefinder, a RIEGL LMS-Q120 Lidar mounted on the roof of the 2006 Volkswagen Passat wagon, keeps a watch for obstacles immediately in the vehicle’s path and allows the vehicle to determine lane markings from brightness differences on the ground.

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A monitor inside the car offers a visual representation of the information the vehicle is receiving from its sensors. It shows the readouts of the radar and laser rangefinders, with Junior at the center of the image on the second floor of Moscone West in San Francisco.

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An emergency fail-safe “kill button” is mounted prominently on the side of the vehicle for quick shut-off in case of unauthorized actions, malfunctions or “robo-rage.”

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The inside of the vehicle has been left largely unchanged, aside from another fail-safe “kill button” and basic controls to switch individual tasks from computer control to human operation.

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Rackable Systems used the Intel Developer Forum to introduce its ICE Cube, a new modular data center.

One such Cube was parked on Fourth Street outside of the conferenece, which started Tuesday and runs through Thursday in San Francisco.

One ICE Cube can contain up to 11,200 processing cores or up to 4.1 petabytes of storage.

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The mobile ICE Cubes are designed to provide flexibility for rapid expansion to areas where traditional data center facilities are unavailable, cost prohibitive or cannot otherwise capitalize on alternative energy sources.

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An ICE Cube can be designed, built and delivered in a matter of weeks and can house up to 1,400 of Rackable Systems’ Eco-Logical rack-mount, DC-powered servers or storage systems. The servers use Intel Xeon chips.

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“A passenger riding in an electric smart car views a GPS map of San Francisco over WiMAX technology on an Echo Peak-enabled Santa Rosa laptop. The demonstration was part of a Wednesday keynote address by Anand Chandrasekher, Intel senior vice president and general manager of the Ultra Mobility Group, at the Intel Developer Forum in San Francisco. Echo Peak will be the industry’s first integrated Wi-Fi/WiMAX module to be offered as an option for notebooks based on Montevina processor technology in 2008.”

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This is a whole wafer of Intel Penryn chips, set to come out this year.

Penryn chips are made on the 45-nanometer process, which means the chips are smaller and faster than current chips built on the 65-nanometer process.

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This Stoakley platform motherboard will go inside servers. It includes a 45-nanometer quad- or dual- core chip and a lot of memory. Stoakley-based servers are set to ship toward year’s end.

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Bonetrail is another motherboard platform for the 45-nanometer generation of chips.

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Here is a side view of Skulltrail, a gaming platform. This will go into boxes for hard-core gamers.

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Here is a motherboard showcasing the X38 chipset, which goes into high-end PCs.

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This is another demo motherboard. Very colorful.Credit: Michael Kanellos/CNET News.com

Intel announced that USB 3.0 will transfer data 10 times faster than the current USB 2.0 technology. USB 3.0 uses both copper and optical connections and likely will arrive in devices in 2009 or 2010, according to Gelsinger.

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The press room at IDF was over twice the size of the press room at other big events, such as Interop, TechEd, and LinuxWorld.

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Avaya showed that it had a sense of humor by supplying the press room with VoIP phones that looked like the old phones we used to rent from Ma Bell.

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Intel reduced paper waste at the event by giving attendees a very small overview pamphlet (right) and a USB key (left) with all of the detailed conference data on it. For those who few who didn’t bring laptops, there were computer stations where attendees could load up the data from the USB drive.

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Intel also killed a few trees by giving away Intel-branded copies of The Wall Street Journal, but that was a popular perk.

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Intel co-founder Gordon Moore

Intel co-founder Gordon Moore

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