CES 2019: Toshiba introduces 1TB M.2 2230 PCIe SSD for embedded and OEM designs

Toshiba's new BG4 SSD uses 96-layer 3D NAND memory, making it the largest capacity SSD in the smallest physical package.

CES 2019: New storage innovations in SD, SSD, and HDDs increase speed and density At CES 2019, makers of portable flash memory cards, as well as solid state and traditional platter hard drives introduced new products benefiting business users and digital professionals.

At CES 2019 on Tuesday, Toshiba announced the BG4, the fourth generation of their ball grid array (BGA) series of solid state drives. Traditionally, these drives are embedded in consumer or enterprise products, though BG4 is also available as a field-replaceable M.2 2230 SSD, which does not require soldering.

Most notably, the BG4 is the first such drive to offer a 1 TB capacity in such a small physical package, enabled through the use of Toshiba's 96-layer 3D "BiCS" TLC NAND, according to a press release. The BG4 is available in 128 GB, 256 GB, 512 GB, and 1 TB capacities, as a 16x20 mm BGA or single-sided M.2 2230 drive, and with an NVMe PCIe 3.0 x4 interface. For security-conscious applications, the BG4 is available as a Pyrite drive or Opal self-encrypting drive.

SEE: CES 2019 news, photos, videos, and more (TechRepublic on Flipboard)

Toshiba claims up to 2,250 MB/sec sequential read and 1,700 MB/sec sequential write performance, and up to 380,000 random read IOPS and 190,00 random write IOPS, which are touted as being 50% better read and 70% better write performance, a 153% improvement in read IOPS, and 90% improvement in write IOPS over the last-generation BG3 product—which used a PCIe 3.0 x2 interface, the release added.

Compared to a standard SSD, the BG4 series lacks DRAM caching, instead relying on NVMe Host Memory Buffer (HMB) to compensate. This allows the BG4 to have a smaller footprint than standard SSDs, but does impact performance relative to a full-size, M.2 2280 SSD. That said, the BG4 and Toshiba's previous products in this category are a more compelling option in the OEM market for embedded devices where slower eMMC memory would be used, such as Chromebooks, tablets, and other systems for which board space is limited.

Samples of the BG4 are already in the hands of OEM customers, with general sample availability "expected later in the second calendar quarter of 2019."

The big takeaways for tech leaders:

  • The BG4 is the first M.2 2230 SSD to reach 1TB capacity, with a PCIe 3.0 x4 interface. It uses 96-layer TLC NAND, and uses NVMe Host Memory Buffer (HMB) instead of a DRAM cache.
  • Toshiba's BG4 products are used more in OEM devices in BGA packages, but are available as field-replaceable M.2 drives.

Also see

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Image: Toshiba

By James Sanders

James Sanders is a staff writer for TechRepublic. He covers future technology, including quantum computing, AI, and 5G, as well as cloud, security, open source, mobility, and the impact of globalization on the industry, with a focus on Asia.